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Home » Aluminium Nitrate Substrate (Purity: 99.5%)


Stock No. CAS MSDS Specification COA
NS6130-10-1103 N/A MSDS pdf Specification pdf

Aluminium Nitrate Substrate

Product : Aluminium Nitrate Substrate (Purity: 99.5%)


Product Aluminium Nitride Substrate
Stock No NS6130-10-1103
CAS 24304-00-5 Confirm
Length 50 mm Confirm
Width 50 mm Confirm
Thickness 50 µm Confirm
Density 3.335 g/cm³ Confirm
Material Aluminum Nitride Ceramic Confirm
Thermal conductivity ≥170 W/m.k (at 30 ℃) Confirm
Flexural Strength 382.7 MPa Confirm
Dielectric strength 18.45 KV/mm Confirm
Volume Resistivity 1.4 x 10^14 Ω.cm Confirm
Quality Control Each lot of Aluminium Nitride Substrate was tested successfully.
Main Inspect Verifier Manager QC

Expert Reviews

Dr. Clive Patterson Ph.D , (Moscow Institute of Physics and Technology, Russia)

Aluminium Nitrate Substrate Performance High purity, small particle size distribution, large specific surface area, high surface activity, low bulk density, good performance of injection molding, composite materials, and good match with the semiconductor silicon, interface compatibility, and can improve the mechanical properties of composite materials and the thermal conductivity of dielectric.

Dr. Ms. Teresa B. , (University of San Carlos, Philippines)

Aluminium Nitrate Substrate Application Manufacturing integrated circuit board, electronic devices, optical devices, radiator, high temperature crucible; Fabrication of metal matrix and polymer matrix composites, especially in the heat seal adhesives and electronic packaging materials have wide application; High thermally conductive ceramics; Composite ceramics, e.g. evaporation boats; Heat sinks; Electrically insulating packages for electronics; Crucibles for metals and salt melts; Thermally conductive filler for polymers; Components for wafer processing.

Dr. Stew Dean Ph.D , (University of Technology Sydney, Australia)

Aluminium Nitrate Substrate is spherical, and their appearance is an off-white powder. Aluminum nitride nanoparticles are known for their small particle size distribution, high heat resistance, high surface activity, high level of purity, firmness, large specific surface area, low bulk density, and good performance of injection molding. These can be readily used with composite materials, and are a good match with the semiconductor silicon. They can improve the mechanical properties of composite materials and the thermal conductivity of dielectric.

Aluminium Nitride Substrate

Aluminium Nitride Substrate

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