Aluminium Nitrate Substrate
Product: Aluminium Nitrate Substrate (Purity: 99.5%)
Quality Control: Each lot of NANOSHEL Aluminium Nitrate Substrate was tested successfully.
|Product Name||Aluminium Nitrate Substrate|
|Thermal conductivity||≥170 W/m·k||Confirm|
|Volume resistivity||>1013 Ω·cm||Confirm|
|Dielectric constant||9 (1MHz, 25°C)||Confirm|
|Dielectric loss||3.8*10-4 1MHz,25°C||Confirm|
|Dielectric strength||17 KV/mm||Confirm|
|Surface roughness Ra||0.3~0.5 µm||Confirm|
|Thermal expansivity||4.6 10-6/°C||Confirm|
|Flexural strength||320~330 MPa||Confirm|
|Modulus of elasticity||310~320 GPa||Confirm|
|Water absorption||0 %||Confirm|
|Melting point||2500 °C||Confirm|
|Main Inspect Verifier||Manager QC|
Dr. Clive Patterson Ph.D (Moscow Institute of Physics and Technology, Russia)
Aluminium Nitrate Substrate Performance High purity, small particle size distribution, large specific surface area, high surface activity, low bulk density, good performance of injection molding, composite materials, and good match with the semiconductor silicon, interface compatibility, and can improve the mechanical properties of composite materials and the thermal conductivity of dielectric.
Dr. Ms. Teresa B. (University of San Carlos, Philippines)
Aluminium Nitrate Substrate Application Manufacturing integrated circuit board, electronic devices, optical devices, radiator, high temperature crucible; Fabrication of metal matrix and polymer matrix composites, especially in the heat seal adhesives and electronic packaging materials have wide application; High thermally conductive ceramics; Composite ceramics, e.g. evaporation boats; Heat sinks; Electrically insulating packages for electronics; Crucibles for metals and salt melts; Thermally conductive filler for polymers; Components for wafer processing.
Dr. Stew Dean Ph.D (University of Technology Sydney, Australia)
Aluminium Nitrate Substrate is spherical, and their appearance is an off-white powder. Aluminum nitride nanoparticles are known for their small particle size distribution, high heat resistance, high surface activity, high level of purity, firmness, large specific surface area, low bulk density, and good performance of injection molding. These can be readily used with composite materials, and are a good match with the semiconductor silicon. They can improve the mechanical properties of composite materials and the thermal conductivity of dielectric.
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