Home » Aluminium Oxinate Sputtering Target (C27H18AlN3O3, Diameter: 2", Thickness: 3mm)

SPUTTERING TARGETS

Stock No. CAS MSDS Specification COA
NS6130-10-1277 2085-33-8 Specification pdf COA pdf

Aluminium Oxinate Sputtering Target (C27H18AlN3O3, Diameter: 2", Thickness: 3mm)

Aluminium Oxinate Sputtering Target

Aluminium Oxinate Sputtering Target (C27H18AlN3O3, Diameter: 2", Thickness: 3mm)

Quality Control: Each lot of NANOSHEL C27H18AlN3O3, Diameter: 2", Thickness: 3mm was tested successfully.

Aluminium Oxinate Sputtering Target

Aluminium Oxinate Sputtering Target

Aluminium Oxinate Sputtering Target

Aluminium Oxinate Sputtering Target

 
Product Name Aluminium Oxinate Sputtering Target
Stock No NS6130-10-1277
CAS 2085-33-8 Confirm
Purity >99 % Confirm
Molecular Formula C27H18AlN3O3 Confirm
Molecular Weight 459.43 g/mol Confirm
Melting Point >300 °C Confirm
Diameter 2 inch Confirm
Thickness 3mm Confirm
Loss on drying ≤0.5% Confirm
Main Inspect Verifier Manager QC

Typical Chemical Analysis

Assay >99 %

Expert Reviews

Dr. Jochen Maier
Dr. Jochen Maier, Ph.D (Canterbury Christ Church University, New Zealand)

Sputtering is a technology capable of depositing thin films from a wide variety of materials on to diverse substrate shapes and sizes. The process is repeatable and can be scaled up from small research and development projects, to production batches involving medium to large substrate areas. The gas use for sputtering is inert such as argon. For efficient momentum transfer projectile mass must match target mass, so for sputtering light elements neon is also used and for heavy elements krypton or xenon.


Dr. Ms. Suvi Ellilä
Dr. Ms. Suvi Ellilä, Ph.D (Halmstad University department of Research & technology, Sweden)

Reactive gases are used to sputter compounds. The chemical reaction can occur on the target surface, in-flight or on the substrate depending on the process parameters. The many parameters make sputter deposition a complex process but allow experts a large degree of control over the growth and microstructure of the film.


Dr. Patrick Nilssen
Dr. Patrick Nilssen, (Northern Private University Olivos, Peru)

Most sputtering target materials can be fabricated into a wide range of shapes and sizes. There are some technical limitations to the maximum size for a given single piece construction. In such cases, a multi-segmented target can be produced with the individual segments joined together by butt or beveled joints. Commonly used targets are circular or rectangular, although other shapes including square and triangular.


Dr. Ms. Maryann Hine
Dr. Ms. Maryann Hine, Ph.D (Brewerville Institute of Technology,Liberia)

Nowadays applications of sputtering range from semiconductor industry for Thin Film deposition of various materials in integrated circuit processing, to architectural window glass for energy conservation, decorative with familiar gold-coloured hard coating created by Titanium Nitride and hardwearing coatings for tools and consumer goods, to deposition of metals during fabrication of CDs and DVDs.


Dr. Peter Worcester
Dr. Peter Worcester, (Murdoch University, Perth, Western Australia)

Sputter Deposition is a method of depositing thin films by sputtering that involves eroding materilas from a “ target” source onto a “substrate” e.g. silicon wafer. Sputtered atoms are ejected into the gas phase but are not in their thermodynamic equilibrium state, and tend to deposit on all surfaces in the vacuum chamber.


Aluminium Oxinate Sputtering Target

Aluminium Oxinate Sputtering Target