Home » Aluminium Nitride Nanopowder (AlN, Purity: 99.9%, APS: 65-75nm, Hexagonal)
Aluminum Nitride Nanopowder – SEM
Aluminum Nitride Nanopowder – Size Analysis
|Product||Aluminum Nitride Nanopowder|
|Molecular Weight||40.982 g/mol||Confirm|
|Thermal Conductivity||80 to 200 W/m-K||Confirm|
|Solubility||Insoluble in water||Confirm|
|Quality Control||Each lot of Aluminum Nitride Nanopowder was tested successfully.|
|Main Inspect Verifier||Manager QC|
Aluminum Nitride Nanopowder Performance High purity, small particle size distribution, large specific surface area, high surface activity, low bulk density, good performance of injection molding, composite materials, and good match with the semiconductor silicon, interface compatibility, and can improve the mechanical properties of composite materials and the thermal conductivity of dielectric.
Aluminum Nitride Nanopowder Application Manufacturing integrated circuit board, electronic devices, optical devices, radiator, high temperature crucible; Fabrication of metal matrix and polymer matrix composites, especially in the heat seal adhesives and electronic packaging materials have wide application; High thermally conductive ceramics; Composite ceramics, e.g. evaporation boats; Heat sinks; Electrically insulating packages for electronics; Crucibles for metals and salt melts; Thermally conductive filler for polymers; Components for wafer processing.
Aluminum Nitride Nanopowder is spherical, and their appearance is an off-white powder. Aluminum nitride nanoparticles are known for their small particle size distribution, high heat resistance, high surface activity, high level of purity, firmness, large specific surface area, low bulk density, and good performance of injection molding. These can be readily used with composite materials, and are a good match with the semiconductor silicon. They can improve the mechanical properties of composite materials and the thermal conductivity of dielectric.
Aluminum Nitride Nanopowder silica gel compounded with Aluminum nitride nanoparticles, which has super thermal conductivity, gives very excellent thermal conductivity, electrical insulation, wider working temperature of electrical insulation (-60℃~-200℃), lower thickness and good operation performance, and can be widely used in the thermal transmission medium of electronic component to improve working efficiency, such as CPU radiator filler, high-power audion, controllable Silicon components, diode, thermal transmission medium in the seam and so on.
Aluminum Nitride Nanopowder can largely improve the thermal conductivity of plastic. By adding Aluminum nitride nanoparticles to plastic according to the proportion of 5%~10% in mass, we can increase the thermal conductivity of plastic from 0.3W/(m˙k) to 0.5W/(m˙k), 16 times more. Compared with the heat conduction stuffing (alumina or magnesia) in the market, it can improve the mechanical properties of products with smaller amount. At present, related manufacturers have purchased Aluminum Nitride Nanopowder powders in mass and the new-type nano heat conduction plastic will be launched to market.
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