High Purity Sputtering Target
Product: Antimony Sputtering Target (Sb, Purity: 99.99%)
Quality Control: Each lot of NANOSHEL Antimony Sputtering Target was tested successfully.
Antimony – Sputtering Target
| Product Name | Antimony Sputtering Target | |
| Product Code | NS6130-10-1030 | |
| Product Code | 7440-36-0 | Confirm |
| Diameter | 50 mm ± 1mm | Confirm |
| Thickness | 3 mm ± 0.5mm | Confirm |
| Purity | >99.99% | Confirm |
| Shape | Round | Confirm |
| Size and Shape | Targets Diameter and thickness can be according to Customer Requirement | |
| Backing Plate | Copper (as per customer requirement) | |
| Conclusion | The specifications Confirm with enterprise standard | |
| Main Inspect Verifier | Manager QC | |
Antimony Sputtering Target Composition:
| Sb | 99.9% | Confirm |
Experts Review:
Dr. Clive Patterson Ph.D (Moscow Institute of Physics and Technology, Russia)
Antimony Sputtering Target is a proven technology capable of depositing thin films from a wide variety of materials on to diverse substrate shapes and sizes. The process is repeatable and can be scaled up from small research and development projects, to production batches involving medium to large substrate areas.
Dr. Ms. Teresa B. (University of San Carlos, Philippines)
High-purity metals for the best results We have the flexibility to produce Antimony Sputtering Target in shapes and sizes, and we never compromise in the purity of our raw materials. Our finished and semi-finished targets and our anodes are all made from the very highest purity of different metals.
Dr. Stew Dean Ph.D (University of Technology Sydney, Australia)
Particulate contamination of thin films is a concern in many industries, including semiconductor manufacturing. Particulates are formed either in the gas phase of the plasma or by flaking off deposited films from wall surfaces. They then become negatively charged and electrostatically trapped in a plasma, where they can increase in size. When the plasma is turned off, or even sooner than that, they can fall onto or be transported otherwise to the substrate. With 0.18 mm feature sizes on a semiconductor wafer, a particle of diameter of 90 nm may result in a killer defect. Particles of this size, and some much larger, are known to grow in plasma processing discharges, including sputtering sources.
Antimony Sputtering Target
Contact us:
Please feel free to send us your requirement about our products
sales@nanoshel.com
contact@nanoshel.com
+1 646 470 4911 (US)
+36 30 4750555 (EU)
+91-9779880077 (India)
Nanoshel’s Product Categories Link:
ZnSe/ZnS QDs WATER SOLUBLE, InP ZnS QDs SURFACE MODIFIED, CdS/ZnS QDs H2O SOLUBLE, PbS QDs SURFACE MODIFIED, ARSENIDES, LANTHANIDE NANOMATERIALS, TRANSITION METAL NANOMATERIALS, SPECIALITY CHEMICALS, MAGNETIC NANOPARTICLES, CUSTOM SYENTHESIS, METALIC FOAMS, SCREEN PRINTED BIO SENSOR, LITHIUM ION BATTERY MATERIAL, ITO COATED GLASS, POLYMERS NANO MATERIAL, NANO FABRIC COATINGS, METAL FOILS, PELLETS CHIPS METAL BALLS, WAFERS & TARGETS, SPUTTERING TARGETS, SINGLE CRYSTAL SUBSTRATES, PYROLITIC GRAPHITE, PROTECTIVE EQUIPMENTS, METAL CRUCIBLES, ALUMINA CERAMIC TILES, INORGANIC COMPOUNDS
