Boron Sputtering Target (Bo, Purity: 99.99%)

High Purity Sputtering Target

Product: Boron Sputtering Target (Bo, Purity: 99.99%)

Quality Control: Each lot of NANOSHEL Boron Sputtering Target was tested successfully.

Bo Sputtering Target Image

Boron – Sputtering Target

Product Name Boron Sputtering Target
Product Code NS6130-10-1130
CAS 7440-42-8 Confirm
Diameter 50 mm ± 1mm Confirm
Thickness 3 mm ± 0.5mm Confirm
Purity >99.99% Confirm
Density 2.08 g/cm³ Confirm
Molecular Weight 10.81 g/mol Confirm
Melting Point 2076 °C Confirm
Shape Round Confirm
Size and Shape Targets Diameter and thickness can be according to Customer Requirement
Backing Plate Copper (as per customer requirement)
Conclusion The specifications Confirm with enterprise standard
Main Inspect Verifier Manager QC

TYPICAL CHEMICAL ANALYSIS

Bo 99.9 % Confirm

Experts Review:


Dr. Clive Patterson Ph.D (Moscow Institute of Physics and Technology, Russia)
Boron Sputtering Target is a non-metallic element which occurs in several allotropes. It is rarely found in nature, normally occurring as borates or orthoboric acid (the abundance of boron in the earth’s crust is 10 ppm, the principal ore being borax, Na2B4O7.xH2O). Amorphous boron is the more common allotrope and exists as a dark powder which is unreactive towards water, oxygen, acids and alkalis. Boron finds importance within nuclear reactors due to its neutron absorbing capabilities, boron steel being used as control rod material. Boron compounds are used for a number of applications including the manufacture of certain grades of glass and detergents.


Dr. Ms. Teresa B. (University of San Carlos, Philippines)
Boron Sputtering Target will react directly with most metals to produce metal borides which are hard, inert binary compounds of various formulae and arrangements of the boron atoms. For example, as single atoms (M2B), pairs (M3B2), single and double chains (MB, M3B4), sheets (MB2), B6 octahedra (MB6) and B12 clusters (MB12). Boron also forms the binary compound, boron nitride, which is of interest as it is isoelectronic with carbon and occurs in two structural modifications; one is a layer structure similar to graphite which is soft and lubricating, whilst the other (formed under high pressure) has a very hard, stable, tetrahedral structure as found in diamond.


Dr. Stew Dean Ph.D (University of Technology Sydney, Australia)
Boron Sputtering Target, Boron Carbide and metal borides, because of their extreme hardness and abrasiveness, are used in the manufacture of specialty saw blades and abrasive wheels. Both have very high melting points: 3350°C and 3000°C, respectively. Due to its high hardness, boron carbide powder is used as an abrasive in polishing and lapping applications, and also as a loose abrasive in cutting applications such as water jet cutting. It can also be used for dressing diamond tools.


Sputtering-Target copy

Boron Sputtering Target



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