Home » Cobalt Iron Boron Sputtering Target (CoFeB, Purity: 99.99%, Dia: 50 mm, Thickness: 3 mm)
SPUTTERING TARGETS
| Stock No. | CAS | MSDS | Specification | COA |
|---|---|---|---|---|
| NS6130-10-1279 | N/A |
|
|
|
Cobalt Iron Boron Sputtering Target
Cobalt Iron Boron Sputtering Target (CoFeB, Purity: 99.99%, Dia: 50 mm, Thickness: 3 mm)
NS1279
Cobalt Iron Boron Sputtering Target
| Product | Cobalt Iron Boron Sputtering Target | |
| Stock No | NS6130-10-1279 | |
| Purity | 99.99% | Confirm |
| Diameter | 50 mm ± 1mm | Confirm |
| Thickness | 3 mm ± 0.5mm | Confirm |
| Molecular Formula | CoFeB | Confirm |
| Shape | Round | Confirm |
| Backing Plate | As per customer requirement | |
| Size and Shape | Targets Diameter and thickness can be according to Customer Requirement | |
| Conclusion | The specifications Confirm with enterprise standard | |
| Quality Control | Each lot of Cobalt Iron Boron Sputtering Target was tested successfully. | |
| Main Inspect Verifier | Manager QC | |
Typical Chemical Analysis
| Assay | 99.99% |
Expert Reviews
Dr. Ms. Suvi Ellilä, Ph.D (Halmstad University department of Research & technology, Sweden)
Reactive gases are used to sputter compounds. The chemical reaction can occur on the target surface, in-flight or on the substrate depending on the process parameters. The many parameters make sputter deposition a complex process but allow experts a large degree of control over the growth and microstructure of the film.
Dr. Patrick Nilssen, (Northern Private University Olivos, Peru)
Most sputtering target materials can be fabricated into a wide range of shapes and sizes. There are some technical limitations to the maximum size for a given single piece construction. In such cases, a multi-segmented target can be produced with the individual segments joined together by butt or beveled joints. Commonly used targets are circular or rectangular, although other shapes including square and triangular.
Dr. Ms. Maryann Hine, Ph.D (Brewerville Institute of Technology,Liberia)
Nowadays applications of sputtering range from semiconductor industry for Thin Film deposition of various materials in integrated circuit processing, to architectural window glass for energy conservation, decorative with familiar gold-coloured hard coating created by Titanium Nitride and hardwearing coatings for tools and consumer goods, to deposition of metals during fabrication of CDs and DVDs.
Dr. Peter Worcester, (Murdoch University, Perth, Western Australia)
Sputter Deposition is a method of depositing thin films by sputtering that involves eroding materilas from a “ target” source onto a “substrate” e.g. silicon wafer. Sputtered atoms are ejected into the gas phase but are not in their thermodynamic equilibrium state, and tend to deposit on all surfaces in the vacuum chamber.
Cobalt Iron Boron Sputtering Target
From us, you can easily purchase Cobalt Iron Boron Sputtering Target at great prices. Place online order and we will dispatch your order through DHL, FedEx, UPS. You can also request for a quote by mailing us at sales@nanoshel.com. We invite you to contact us for further information about our company and our capabilities. At Nanoshel, we could be glad to be of service to you. We look forward to your suggestions and feedback.
+1 646 470 4911
Europe (West) - General Enquiries:+44 1782 454144, +44 (0) 74 105 48802
Europe (East) - Sales/Research:+36 30 4750555
India - Sales/Research:+91-9779550077
Note *Exchanges of materials/products are not permitted. Nanoshel does not offer refunds. *US Dollar Cheques Not Accepted, Only Bank TT/Credit Cards Accepted
Ask Nanoshel
Please feel free to
send us your
requirement
about our products
search
Search by Product, Stock No and CAS
Dr. Jochen Maier, Ph.D (Canterbury Christ Church University, New Zealand)
Sputtering is a technology capable of depositing thin films from a wide variety of materials on to diverse substrate shapes and sizes. The process is repeatable and can be scaled up from small research and development projects, to production batches involving medium to large substrate areas. The gas use for sputtering is inert such as argon. For efficient momentum transfer projectile mass must match target mass, so for sputtering light elements neon is also used and for heavy elements krypton or xenon.