High Purity Copper Silicate Nano Powder
Product Copper Silicate Nano Powder (CuO3Si, Purity: >99.9%, ASP: <50nm)
Quality Control: Each lot of Copper Silicate Nano Powder was tested successfully.
|Materials||Copper Silicate Nano Powder|
|Boiling / Flash Point||2170°C||Confirm|
|Solubility In Water||0.1 g per 100cc||Confirm|
|Available Quantities||25Gms, 50Gms, 100Gms and larger quantities|
|Main Inspect Verifier||Manager QC|
Dr. Bruce Perrault, Ph.D (Georgia Institute of Technology (Georgia Tech), USA)
The use of Copper Silicate Nanoparticles for treating and preventing Herpes virus (HV) infections and diseases and in particular diseases caused by HSV- 1 or HSV-2 such as herpes and Varicella zoster (VZV) such as shingles. Copper Silicate Nanoparticles compositions specifically adapted to treat HV infections. HSV disrupts host cell molecular functions and host cellular structure and is manifested clinically as host cellular death, resulting in shallow, painful vesicular ectodermal lesions or by hemorrhagic encephalitic necrosis of the brain. Target tissues for HSV are the skin or mucous membranes usually derived from embryonic ectoderm: mouth, skin, vagina, conjunctiva, cornea, etc. The copper silicate may also be combined with anaesthetics.
Dr. Myron Rubenstein, Ph.D (Polytechnic University of Turin, Italy)
Copper Silicate Nanoparticles, it is important to understand the nature of the metal bearing minerals from a metallurgical standpoint. While traditional mineralogy can provide some qualitative insight into this, diagnostic leaching allows the ore to be evaluated quantitatively by mineral type and can potentially lead to a metallurgical process. The application of diagnostic leaching is important for both initial exploration and when the ore is already being treated in the process plant. The basic methodology of diagnostic leaching applied to copper silicate ores.
Dr. Huojin Chan (University of Science and Technology of China, Hefei, Anhui, China)
The wide variety of applications for advanced technologies. Ceramic metal bonding is used for structural applications such as high-temperature aerospace structures, composite materials, biomaterials, wear and corrosion resistant coated components, and electronic applications such as in the fabrication of microelectronic devices, electronic interconnections, and optical devices. Copper Silicate Nanoparticles interfaces play a critical role in technologies as diverse as microelectronics.
Dr. Ms. Yi Yen Shi, (King Mongkut’s University of Technology Thonburi,Bangkok, Thailand)
Copper Silicate Nanoparticles interfaces with MNLs and examines the effect of functional group and interface chemistry on the mechanical properties of the engineered biomaterial interfaces. Thermal annealing of Cu-silica interfaces tailored with MNLs lead to interface toughening through the formation of strong bonding. An important finding of this thesis is the application of strained low-polarizability cyclic rings as MNLs, which can toughen the interface through Cu-catalyzed bonding. Seven fold increase in interface toughening is reported through annealing by using cyclic moieties in MNL at Cu-silica interface. The increase is due to strong chemical bonding at the Cu-MNL and MNL-silica interface. These findings open up possibilities for directly integrating metals with low permittivity dielectrics without using an additional glue layer, for various technological applications.
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