Metal Dispersion
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Copper Suspension
Cu, Purity: >99%, APS: <50nm
Copper Suspension
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Product | Copper Suspension | |
Stock No | NS6130-12-001569 | |
CAS | 7440-50-8 | Confirm |
Purity | >99% | Confirm |
APS | <50nm | Confirm |
Molecular Formula | Cu | Confirm |
Molecular Weight | 63.55g/mol | Confirm |
Form | liquid | Confirm |
Density | 8.96g/cm³ | Confirm |
Thermal Expansion | (25 °C) 16.5 µm•m-1•K-1 | Confirm |
Poisson’s Ratio | 0.34 | Confirm |
Vickers Hardness | 369 MPa | Confirm |
Young’s Modulus | 110–128 GPa | Confirm |
Quality Control | Each Lot of was tested successfully | |
Main Inspect Verifier | Manager QC |
Typical Chemical Analysis
Assay | >99% |
Other Metal | 9000ppm |
Expert Reviews

Copper Suspension
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