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Silicon/Cellulose Wafers

Stock No.
NS6130-10-1120
CAS
7440-21-3
MSDS
MSDS-PDF
Specifications
SPEC-PDF
COA
COA-PDF
Catalogue

CZ Silicon Wafers P Type Boron

(3 inches, Single Side Polished)
CZ Silicon Wafers P Type Boron
NS1120
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Preview
CZ Silicon Wafers P Type Boron
ProductSilicon Wafer 3”
Stock NoNS6130-10-1120
CAS7440-21-3Confirm
Diameter3”Confirm
Thickness200µmConfirm
DopantBoronConfirm
Crystal Orientation<100>Confirm
TypePConfirm
Growth MethodCZConfirm
Resistivity1.0-5.0Ω.cmConfirm
TTV<10.0µmConfirm
STIR<2µmConfirm
GLOBAL TIR<5µmConfirm
Warp<50.0µmConfirm
LPD<30 counts @ particles size>0.3µmConfirm
Laser MarkNoneConfirm
Edge ProfileRoundedConfirm
Front SurfacePolishedConfirm
Back SurfaceEtchedConfirm
Bow<50.0µmConfirm
Quality ControlEach Lot of CZ Silicon Wafers P Type Boron was tested successfully
Main Inspect VerifierManager QC

Expert Reviews

product-expert-image
Dr. Henrik Jensen,Ph.D (Middle East Technical University Ankara, Turkey)

Silicon wafers are key component in integrated circuits. Integrated circuits are, simply put a composite of various electronic components that are arranged to perform a specific function. Silicon is the principle platform for semiconductor devices. A wafer is a thin slice of the semiconductor material, which serves as the substrate for microelectronic devices built in and over the wafer.

product-expert-image
Dr. Chiyoko Hayashi (Osaka University Suita, Japan)

As silicon wafer’s primary use is in integrated circuits. Integrated circuits power many of devices that can be used by society everyday. Computers and smartphones are just two of the devices that are dependent on this technology. Silicon is the stable among all the semiconductors. Other uses include sensors, such as the tire pressure sensor system and solar cells. Silicon wafers absorbs the photons in sunlight and this in turn create electricity.

product-expert-image
Dr. Joris Smits, Ph.D (Wrocław University of Technology, Poland)

The wafers serves as the substrates for microelectronic devices built in and over the wafer and undergoes many microfabrication process steps such as doping or ion implantation, etching, deposition of various materials and photolithographic pattering.

product-expert-image
Dr. Ms. Sally Adams (National Technical University of Athens)

Silicon wafers are available in a variety of diameters from 25.4mm (1 inch) to 300mm. The diameter has gradually increased to improve throughput and reduce cost with the current state –of-the-art of fab considered to be 300mm with the next standard projected to be 450mm.

product-expert-image
Dr. Peter Bruggmann (Technical University of Madrid, Spain)

Wafer thickness is determined by the mechanical strength of the material used the wafer must be thick enough to support its own weight without cracking during handling. Wafers are grown from crystals having a regular crystal structure, with silicon having a diamond cubic structure. Orientation is defined by the Miller index with (100) or (111) faces being the most common for silicon. Ion implantation depths depend on the wafer’s crystal orientation, since each direction offers distinct paths for transport.

nanoshel-experts

CZ Silicon Wafers P Type Boron

Contact Us:
From us, you can easily purchase CZ Silicon Wafers P Type Boron (3 inches, Single Side Polished) at great prices. Place online order and we will dispatch your order through DHL, FedEx, UPS. You can also request for a quote by mailing us at sales@nanoshel.com. We invite you to contact us for further information about our company and our capabilities. At Nanoshel, we could be glad to be of service to you. We look forward to your suggestions and feedback.
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+91-9779238252
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CZ Silicon Wafers P Type Boron (3 inches, Single Side Polished)

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