Pure Copper Foam ( Cu, Purity: 99.9%, Thickness: 4mm)

Pure Copper Foam

Product: Pure Copper Foam ( Cu, Purity: 99.9%, Thickness: 4mm)

Quality Control: Each lot of NANOSHEL Highly Pure Copper Foam was tested successfully.

Pure Copper Foam Image

Pure Copper Foam

Stock No. NS6130-10-1010
Type Open Cell
PPI 50
Density 0.80-0.85 g/cc
Purity ≥99.8%
Porosity ≥90%
Dimension 500mm X 500mm
Thickness 4mm
Sheet Volumetric Area 750cm³
30 Sheets Volumetric Area 22500cm³

Physical Characteristics of Nanoshel Pure Copper Foam

Compression Strenth 131 psi
Tensile Strength 1000 psi
Shear Strength 190 psi
Modulus of Elasticity (Compression) 107 kpsi
Modulus of Elasticity (Tension) 14.6 × 103 psi
Shear Modulus 40.9 kpsi
Vickers Hardness 35
Specific Heat 0.092 BTU/lb-°F
Bulk Thermal Conductivity 5.84 BTU/ft-hr-F
Coefficient of Thermal Expansion 9.44× 10-6 in/in–F
Bulk Resistivity 2.56× 10-5 ohm – in
Melting Point 1980°F

Experts Review:

Terence Mitchell, PhD,(ICAI School of Engineering Madrid, Spain)Terence Mitchell, PhD,(ICAI School of Engineering Madrid, Spain)
Pure Copper Foam has an extremely high thermal conductivity. Nanoshel Pure Copper Foam is used in very high performance heat exchangers where weight and cost are of low priority. Because of the greater surface area of Nanoshel Pure Copper Foam heat transfer to fluids flowing through the foam is greatly accelerated over solid copper and copper fins.


Dr. Steven Atkinson,Professor(University of Nottingham,UK)Dr. Steven Atkinson,Professor(University of Nottingham,UK)
Nanoshel Pure Copper Foam are highly resistant to atmospheric corrosion and to corrosion in potable water. Copper is also resistant to many organic and inorganic materials, and is well known for excellent corrosion resistance.


Dr. Ms. Huian Ruan(Taungoo Technological University, Myanmar)Dr. Ms. Huian Ruan(Taungoo Technological University, Myanmar)
Pure Copper Foam has excellent mechanical property and process ability. Extraordinary electricity and heat conductivity. Massive three- dimensional network structure. Excellent base & corrosion resistant ability. Magnificent electromagnetic shielding ability. Superior tensile strength and favorable ductility


Dr. Marco Ferro,MD PhD(University of Nordland Bodø, Norway)Dr. Marco Ferro,MD PhD(University of Nordland Bodø, Norway)
Pure Copper Foam heat diffusion, dissipation and exchange materials for electronic components such as CPU, display card and LED etc. Electrode material for batteries, such as lithium ion battery, fuel cell, nickel-zinc battery, etc. Electromagnetic shielding material. Catalyst and its carrier material. Various initial-efficiency, intermediate-effeciency and sub-micron filtration material. Decoration materials for construction.


Dr. Guowei Kwong, PhD(Ho Chi Minh City University of Science, Vietnam)Dr. Guowei Kwong, PhD(Ho Chi Minh City University of Science, Vietnam)
Pure Copper Foam can be used in a number of applications. Some of the basic applications include electrode material for batteries, such as nickel-zinc battery, lithium ion battery and fuel cell; heat diffusion, dissipation and exchange materials for electronic components such as LED, display card and CPU; catalyst and its carrier material; electromagnetic shielding material; decoration materials for construction; and a variety of sub-micron filtration, initial- efficiency and intermediate-efficiency materials.


Pure Copper Foam Banner

Pure Copper Foam

Contact Us for Pure Copper Foam 
free quote

From us, you can easily purchase nano materials at great prices. Place online order and we will dispatch your order through DHL, FedEx, UPS. You can also request for a quote by mailing us at sales@nanoshel.com Contact: +1 302 268 6163 (US and Europe), Contact: +91-9779550077 (India). We invite you to contact us for further information about our company and our capabilities. At Nanoshel, we could be glad to be of service to you. We look forward to your suggestions and feedback.

More Metal Foams By Nanoshel

NS6130-10-1005 – Copper Foam-120PPI/1mm as heat absorbing materials

NS6130-10-1006 – Copper Foam Heat Sink Material-50PPI/1mm

NS6130-10-1007 – Copper Foam Battery Electrode Materials – 50PPI/2mm

NS6130-10-1008 – Nickel Metal Foam – 50PPI/2mm

NS6130-10-1009 – Chemical Catalyst Carrier Copper Foam-50PPI/3mm

NS6130-10-1010 – Copper Metallic Foam-50PPI/4mm

NS6130-10-1011 – Copper metal Foam – 50PPI/5mm

NS6130-10-1093 – Nickel Foam for Battery-50PPI/3mm

NS6130-10-1095 – Stainless Steel Foam-50PPI/3mm

NS6130-10-1230 – Polyethylene Foam (Closed Cell, Purity: >99.9%)