Product | Silver Copper Alloy Dispersion | |
Stock No | NS6130-04-467 | |
CAS | 7440-22-4/7440-50-8 | Confirm |
Purity | 99.9 % | Confirm |
APS | <80nm | Confirm |
Molecular Formula | Ag:Cu | Confirm |
Form | Liquid | Confirm |
pH | 4-5 | Confirm |
Concentration | 2-3 wt% (Available as per Customer requirement) | |
Dispersing Agent | Organic Solvent (DMF), IPA, Ethanol, Water (ddH2O) | |
Quality Control | Each Lot of Silver Copper Alloy Dispersion was tested successfully | |
Main Inspect Verifier | Manager QC |
Typical Chemical Analysis
Assay | 99.9% |
Silver Copper Alloy Dispersion One of the most promising and recent areas of research in modern science is nanotechnology. The major thrust has been developing new materials and examining their properties by tuning the particle size, shape and distribution. Metal nanoparticles have been extensively studied due to their specific characteristics such as catalytic activity optical properties, electronic properties, antimicrobial properties, electrochemical properties, and corrosion inhibition properties on silver and copper dispersion.
Silver Copper Alloy Dispersion solution of metal nanoparticles exert bactericidal, fungicidal and virucidal effect on living organisms water dispersed solution it different concentration of copper and silver nano particales substantially influence germination of seeds of grain and vegetable crops.
Silver Copper Alloy Dispersion The antibacterial potential of copper and silver nanoparticles dispersed in a phenolic resin. Silver and copper nanoparticles as an antibacterial agent for the remediation of water silver copper nanoparticles dispersion material that can potentially used as antibacterial agent.
Silver Copper Alloy Dispersion, Active antibacterial substance can also incorporated into coating on implant surface. Metallic element copper and silver also possess antimicrobial activity. Copper inhibited bacterial growth and adhesion. Silver is used for its bactericidal properties in a large number of products.
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Silver Copper Alloy Dispersion (Ag:Cu, Purity: 99.9 %, APS: <80nm)