SOI Wafer 4 P Type (Purity: 99.9% Dia: 4”(100mm)CZ Thickness: 430µm)

SOI Wafer 4 P Type

Product: SOI Wafer 4 P Type (Purity: 99.9% Dia: 4”(100mm)CZ Thickness: 430µm)

Quality Control: Each lot of NANOSHEL SOI Wafer 4 P Type  was tested successfully.

Product Name SOI Wafer 4” P Type
Stock No. NS6130-10-1309
CAS 7440-21-3 Confirm
Diameter 4” (100mm) Confirm
Thickness 430µm Confirm
Purity 99.9% Confirm
Molecular Formula Si Confirm
Molecular Weight 28.09g/mol Confirm
Front Surface Polished Confirm
Back Surface Etched Confirm
Type P- type Confirm
Doping Boron Confirm
Density 2.3g/cm3 Confirm
Melting Point 1410°C Confirm
Boiling Point 2355°C Confirm
Resistivity 0-100Ωcm Confirm
Main Inspect Verifier Manager QC

 Experts Review:

Miller-(Christopher)-345x239Dr. Baron Augustin, Ph.D (TUM)(Technical University of Munich, Germany)
Silicon is the second most common element on Earth and it is the seventh-most common element in the entire universe. It is the most common semi conductor and the most widely used in the electronic and technology sector. There are different silicon fabrication methods including the horizontal gradient freeze method, the horizontal Bridgeman method, the vertical Bridgeman method, the vertical gradient freeze and finally the Czochralski pulling method.


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Dr. Darren Chandler, Ph.D(Manchester Metropolitan University, U.K)
Silicon wafers are a key component in integrated circuits. Integrated circuits are, simply put, a composite of various electronic components that are arranged to perform a specific function. Silicon is the principle platform for semiconductor devices. A wafer is a thin slice of this semiconductor material, which serves as the substrate for microelectronic devices built in and over the wafer.


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Dr. Ms. Cristiana Barzetti (University of Cagliari-Department of Chemical Engineering and Material Science, Italy)
Only a thin layer on the surface of a silicon wafer is used for making electronic components; the rest serves essentially as a mechanical support. The role of Silicon on insulators (SOI) is to electronically insulate a fine layer of monocrystalline silicon from the rest of the silicon wafer. Integrated circuits can then be fabricated on the top layer of the SOI wafers using the same processes as would be used on plain silicon wafers. The embedded layer of insulation enables the SOI-based chips to function at significantly higher speeds while reducing electrical losses. The result is an increase in performance and a reduction in power consumption. There are two types of SOI wafers.


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Dr. Jang Huang, Ph.D (Shandong Science and Technology University, China)
Silicon wafers primary use is in integrated circuits. Integrated circuits power many of the devices that modern society uses every day. Computers and smart phones are just two of the devices that are dependent on this technology. Although other semiconductors have been tested overtime, silicon has proved to be stable option. Other uses include sensors, such as the tire pressure sensor system, and solar cells. Silicon wafers absorb the photons in sunlight and this in turn creates electricity. Silicon wafers are also used for various coating applications of nanomaterials such as biosensing.


images (21)Dr. Mark Brown (Georgia Institute of Technology in Atlanta,USA)
Silicon is the most economical IR material available. Both P-type and N-type substrates are acceptable for IR optics provided that they offer transmission greater than 50% in the 1.5 to 6 micron wavelength. Generally speaking, for N-type, the resistivity should be greater than 20 ohm-cm and, for P-type, greater than 40 ohm-cm. For use in the near IR, this is not so critical, but for applications for the far IR, resistivity can be critical. Float Zone Silicon most always meets criteria for optical use.


SOI Wafer:

Silicon Wafer



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