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Sputtering Targets

Stock No.
NS6130-10-1046
CAS
7440-67-7
MSDS
MSDS-PDF
Specifications
SPEC-PDF
COA
COA-PDF
Catalogue
MSDS pdf

Zirconium Sputtering Target

(Zr, Purity: 99.99%, Dia: 50.8mm)
Available Pack Size: 1Pc, 2Pcs, 5Pcs, 10Pcs & Bulk orders
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Preview
Zirconium Sputtering Target
ProductZirconium Sputtering Target
Stock NoNS6130-10-1046
CAS7440-67-7Confirm
Purity 99.99%Confirm
Diameter 50.8 mm ± 1mmConfirm
Thickness 3 mm ± 0.5mmConfirm
Molecular Weight 91.224 g/molConfirm
Density 6.52 g/cm³Confirm
Melting Point 1855 °CConfirm
Shape RoundConfirm
Backing Plate Copper (as per customer requirement)
Size and Shape Targets Diameter and thickness can be according to Customer Requirement
ConclusionThe specifications Confirm with enterprise standard
Quality ControlEach Lot of Zirconium Sputtering Target was tested successfully
Main Inspect VerifierManager QC

Typical Chemical Analysis

Assay99.99%
Other Metal80ppm

Expert Reviews

product-expert-image
Dr. Jochen Maier Ph.D (Canterbury Christ Church University, New Zealand)

Sputtering is a technology capable of depositing thin films from a wide variety of materials on to diverse substrate shapes and sizes. The process is repeatable and can be scaled up from small research and development projects, to production batches involving medium to large substrate areas. The gas use for sputtering is inert such as argon. For efficient momentum transfer projectile mass must match target mass, so for sputtering light elements neon is also used and for heavy elements krypton or xenon.

product-expert-image
Dr. Ms. Suvi Ellilä Ph.D (Halmstad University department of Research & technology, Sweden)

Reactive gases are used to sputter compounds. The chemical reaction can occur on the target surface, in-flight or on the substrate depending on the process parameters. The many parameters make sputter deposition a complex process but allow experts a large degree of control over the growth and microstructure of the film.

product-expert-image
Dr. Patrick Nilssen (Northern Private University Olivos, Peru)

Most sputtering target materials can be fabricated into a wide range of shapes and sizes. There are some technical limitations to the maximum size for a given single piece construction. In such cases, a multi-segmented target can be produced with the individual segments joined together by butt or beveled joints. Commonly used targets are circular or rectangular, although other shapes including square and triangular.

product-expert-image
Dr. Ms. Maryann Hine Ph.D (Brewerville Institute of Technology,Liberia)

Nowadays applications of sputtering range from semiconductor industry for Thin Film deposition of various materials in integrated circuit processing, to architectural window glass for energy conservation, decorative with familiar gold-coloured hard coating created by Titanium Nitride and hardwearing coatings for tools and consumer goods, to deposition of metals during fabrication of CDs and DVDs.

product-expert-image
Dr. Peter Worcester (Murdoch University, Perth, Western Australia)

Sputter Deposition is a method of depositing thin films by sputtering that involves eroding materilas from a “ target” source onto a “substrate” e.g. silicon wafer. Sputtered atoms are ejected into the gas phase but are not in their thermodynamic equilibrium state, and tend to deposit on all surfaces in the vacuum chamber.

nanoshel-experts

Zirconium Sputtering Target

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From us, you can easily purchase Zirconium Sputtering Target (Zr, Purity: 99.99%, Dia: 50.8mm) at great prices. Place online order and we will dispatch your order through DHL, FedEx, UPS. You can also request for a quote by mailing us at sales@nanoshel.com. We invite you to contact us for further information about our company and our capabilities. At Nanoshel, we could be glad to be of service to you. We look forward to your suggestions and feedback.
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Zirconium Sputtering Target (Zr, Purity: 99.99%, Dia: 50.8mm)

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