Home » Aluminium Chromium Alloy Sputtering Target (AlCr, Purity: 99.99%)

SPUTTERING TARGETS

Stock No. CAS MSDS Specification COA
NS6130-10-1188 N/A Specification pdf COA pdf

Aluminium Chromium Alloy Sputtering Target (AlCr, Purity: 99.99%)

Aluminium Chromium Alloy Sputtering Target 

Aluminium Chromium Alloy Sputtering Target (AlCr, Purity: 99.99%)

Quality Control: Each lot of NANOSHEL AlCr, Purity: 99.99% was tested successfully.

Aluminium Chromium Alloy Sputtering Target 

Aluminium Chromium Alloy Sputtering Target 

 
Product Name Aluminium Chromium Alloy Sputtering Target 
Stock No NS6130-10-1188
Purity 99.99% Confirm
Diameter 50 mm ± 1mm Confirm
Thickness 3 mm ± 0.5mm Confirm
Shape Round Confirm
Size and Shape Targets Diameter and thickness can be according to Customer Requirement
Backing Plate Copper (as per customer requirement)
Conclusion The specifications Confirm with enterprise standard
Main Inspect Verifier Manager QC

Typical Chemical Analysis

Al 50 %
Cr 50 %

Expert Reviews

Dr. Jochen Maier
Dr. Jochen Maier, Ph.D (Canterbury Christ Church University, New Zealand)

Aluminium Chromium Alloy Sputtering Target is a technique used deposite thin films of a material onto a surface. There are many different ways to deposite materials such as metals , plastic and ceramics. Aluminum coating found on telescopes, automotive headlamps, mirrors, etc. it is widely used in the aerospace, automotive lighting,OLED etc.


Dr. Ms. Suvi Ellilä
Dr. Ms. Suvi Ellilä, Ph.D (Halmstad University department of Research & technology, Sweden)

Aluminium Chromium Alloy Sputtering Target primary market is sputtering targets used to make interconnects for integrated circuits. For some applications the impurities uranium and thorium are reduced to less than 1 ppbw to avoid “soft errors” associated with α particle emission. The crystallization process achieves segregation coefficients which are close to theoretical at normal yields, and this, coupled with the scale of the units, allows practical production of this material. The silicon purification process involves crystallization of Si from molten aluminum alloys containing about 30% silicon.


Dr. Patrick Nilssen
Dr. Patrick Nilssen, (Northern Private University Olivos, Peru)

Aluminium Chromium Alloy Sputtering Target crystallites from this process are further treated to remove residual Al and an extreme purity ingot is obtained. This material is considered suitable for single crystal or ribbon type photovoltaic cells and for certain IC applications, including highly doped substrates used for epitaxial growth. In production of both extreme purity Al and Si, impurities are rejected to the remaining melt as the crystals form and some separation is achieved by draining this downgraded melt from the unit.


Aluminium Chromium Sputtering Target

Aluminium Chromium Sputtering Target