Aluminium Chromium Alloy Sputtering Target
Product: Aluminium Chromium Alloy Sputtering Target (AlCr, Purity: 99.99%)
Quality Control: Each lot of NANOSHEL Aluminium Chromium Alloy Sputtering Target was tested successfully.
|Product Name||Aluminium Chromium Alloy Sputtering Target|
|Diameter||50 mm ± 1mm||Confirm|
|Thickness||3 mm ± 0.5mm||Confirm|
|Size and Shape||Targets Diameter and thickness can be according to Customer Requirement|
|Backing Plate||Copper (as per customer requirement)|
|Conclusion||The specifications Confirm with enterprise standard|
|Main Inspect Verifier||Manager QC|
TYPICAL ANALYSIS Aluminium Chromium Alloy Sputtering Target
Dr. Clive Patterson Ph.D (Moscow Institute of Physics and Technology, Russia)
Aluminium Chromium Alloy Sputtering Target is a technique used deposite thin films of a material onto a surface. There are many different ways to deposite materials such as metals , plastic and ceramics. Aluminum coating found on telescopes, automotive headlamps, mirrors, etc. it is widely used in the aerospace, automotive lighting,OLED etc.
Dr. Ms. Teresa B. (University of San Carlos, Philippines)
Aluminium Chromium Alloy Sputtering Target primary market is sputtering targets used to make interconnects for integrated circuits. For some applications the impurities uranium and thorium are reduced to less than 1 ppbw to avoid “soft errors” associated with α particle emission. The crystallization process achieves segregation coefficients which are close to theoretical at normal yields, and this, coupled with the scale of the units, allows practical production of this material. The silicon purification process involves crystallization of Si from molten aluminum alloys containing about 30% silicon.
Dr. Stew Dean Ph.D (University of Technology Sydney, Australia)
Aluminium Chromium Alloy Sputtering Target crystallites from this process are further treated to remove residual Al and an extreme purity ingot is obtained. This material is considered suitable for single crystal or ribbon type photovoltaic cells and for certain IC applications, including highly doped substrates used for epitaxial growth. In production of both extreme purity Al and Si, impurities are rejected to the remaining melt as the crystals form and some separation is achieved by draining this downgraded melt from the unit.
Please feel free to send us your requirement about our products
+1 646 470 4911 (US)
+36 30 4750555 (EU)
Nanoshel’s Product Categories Link:
ORGANIC COMPOUNDS, METAL ORGANIC FRAMEWORKS, FEED GRADE ACTIVE PHARMACEUTICAL INGREDIENT, ORGANIC FLUORINE MATERIALS, NEW PRODUCTS, METAL MICRO POWDER, OXIDE MICRO POWDER, COMPOUND MICRO POWDER, ALLOY MICRO POWDER, CLAY POWDER, CARBON POWDER, 3D PRINTING POWDER, ULTRA HIGH TEMPERATURE CERAMICS NANOMATERIALS, ACETATES BORATES NANOMATERIALS, CARBIDES ALUMINATES NANOMATERIALS, CHLORIDES NANOMATERIALS, FLUORIDES NANOMATERIALS, NITRATES/SULPHIDES, SILICATES/TITANATES, STIMULATES/ALUMINATES NANOMATERIALS