Gallium Nitride Substrate
Product: Gallium Nitride Substrate (Purity: 99.5%)
Quality Control: Each lot of NANOSHEL Gallium Nitride Substrate was tested successfully.
|Product Name||Gallium Nitride Substrate|
|Primary Flat Location||(1-100)+/-0.5o||Confirm|
|Primary Flat Length||16+/-1mm||Confirm|
|Secondary Flat Location||(11-20)+/-3o||Confirm|
|Secondary Flat Length||8+/-1mm||Confirm|
|Marco Defect Density||<=2cm-2||Confirm|
|Main Inspect Verifier||Manager QC|
Dr. Clive Patterson Ph.D (Moscow Institute of Physics and Technology, Russia)
Gallium Nitride Substrate has the advantages of high wear-resisting,electric insulation,resistant acid-base, high intensity,high temperature tolerance, high strength , precision process, high mechanical strength, good chemical stability, polishing surface and so on.
Dr. Ms. Teresa B. (University of San Carlos, Philippines)
GaN devices are used as various components in high-power and high-frequency power electronics like cellular base stations, satellites, power amplifiers, and inverters/converters for electric vehicles (EV) and hybrid electric vehicles (HEV). GaN’s low sensitivity to ionizing radiation (like other group III nitrides) makes it a suitable material for spaceborne applications such as solar cell arrays for satellites and high-power, high-frequency devices for communication, weather, and surveillance satellites
Dr. Stew Dean Ph.D (University of Technology Sydney, Australia)
Particulate contamination of thin films is a concern in many industries, including semiconductor manufacturing. Particulates are formed either in the gas phase of the plasma or by flaking off deposited films from wall surfaces. They then become negatively charged and electrostatically trapped in a plasma, where they can increase in size. When the plasma is turned off, or even sooner than that, they can fall onto or be transported otherwise to the substrate. With 0.18 mm feature sizes on a semiconductor wafer, a particle of diameter of 90 nm may result in a killer defect. Particles of this size, and some much larger, are known to grow in plasma processing discharges, including sputtering sources.
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