Lead Free Solder Paste (No Clean Lead Clean Solder Flux Free Paste)

Lead Free Solder Paste

Product: Lead Free Solder Paste (No Clean Lead Clean Solder Flux Free Paste)

Quality Control: Each lot of NANOSHEL Lead Free Solder Paste was tested successfully.

Product Name Lead Free Solder Paste (No Clean Lead Clean Solder Flux Free Paste)
Stock No. NS6130-12-000907
CAS 7440-57-5/7440-31-5 Confirm
Gold(Au) 80% Confirm
Tin(Sn) 20% Confirm
Color and Appearance Light Straw Liquid Confirm
Solids Content 4.55% Confirm
Flash Point 53°F Confirm
Density 0.810 +/- 0.006 Confirm
Surface Insulation Resistance 004 >1.00 x 1011ΩJ Confirm
Shelf life >2 years Confirm
Main Inspect Verifier Manager QC

 Experts Review:

Dr. Marcus Tägtmeyer (International Medical and Technological University, Dar es Salaam, Tanzania)


Dr. Marcus Tägtmeyer (International Medical and Technological University, Dar es Salaam, Tanzania)
Metal powder can be referred to as as finely divided solid, smaller than 1000 µm in its maximum dimension. Particles are defined as the smallest unit of a powder. The particles of most of the metal powders exist in the sizes of 25 – 200µm.


Dr. Ms Jane Li (National Penghu University of Science and Technology, Magong, Penghu, Republic of China)
Dr. Ms Jane Li (National Penghu University of Science and Technology, Magong, Penghu,  Republic of China)
A metal powder can be easily shaped, with the desirable properties of a solid after processing. Metal powders are used in variety of applications. Their use in powder metallurgy results in a variety of products, including dental restorations, oil-less bearings, automotive transmission gears, armor piercing projectiles, electrical contacts, nuclear power fuel elements, orthopedic implants, business machine parts, high-temperature filters, aircraft brake pads, etc. Metal powders have also found uses in products, such as paint pigments, rocket fuels, explosives, catalysts, printing inks, and many others.


Dr. Willem-Jan de Kleijn Ph.D (Luleå University of Technology, Luleå, Sweden)
Dr. Willem-Jan de Kleijn Ph.D (Luleå University of Technology, Luleå, Sweden)
Metal powders are a comparatively small activity when compared to common powders such as cereal and sand. The most widely used metal powders are iron and steel, which are followed by aluminum, copper, nickel, tungsten, etc


Dr. JKF Gojukai PhD (Kaiserslautern University of Technology, Kaiserslautern, Rhineland-Palatinate, Germany)
Dr. JKF Gojukai PhD (Kaiserslautern University of Technology, Kaiserslautern, Rhineland-Palatinate, Germany)
The main characteristics of metal powders include the particle size distribution, particle shape, the surface condition and the structure of the powder which impact the bulk properties such as compressibility, reactivity, flow ability, porosity, and hardenability which gets improved as particle size gets smaller.


Dr. Huang Fu Ph.D (Maebashi Institute of Technology, Maebashi, Gunma, Japan)
Dr. Huang Fu Ph.D (Maebashi Institute of Technology, Maebashi, Gunma, Japan)
Metal powders can be made either by gas atomization or grinding and are then classified using dynamic classifiers to attain the precise particle size distribution. The powders are metallic, however in some instances they are blended with other forms such as polymers or ceramics. Powders resemble a behavior, which is intermediate between that of a solid and liquid.


Lead Free Solder Paste


Contact Us:

Please feel free to send us your requirement about our products
sales@nanoshel.com
contact@nanoshel.com
+1 646 470 4911 (US)
+36 30 4750555 (EU)
+91-9779880077 (India)


Nanoshel’s Most Moving Products:

NS6130-01-101 – Silver (Ag) Nanoparticles / Nanopowder (Ag, 99.99%, 80-100 nm, metal basis)

NS6130-01-105 – Aluminium Nanoparticles/Nanopowder (Al, 99.9%, APS: 100nm, Metal basis)

NS6130-01-128 – Copper Nanoparticles/Nanopowder (Cu, Purity: 99.9%, APS: 80-100nm, Metal Basis)

NS6130-01-108 – Gold (Au) Nanopowder (Au, 99.99+%, 50-100 nm)

NS6130-02-219 – Antimony Tin Oxide Nanoparticles (ATO, SnO2:Sb2O3=90:10, 99.8%, 30nm)

NS6130-03-301 – Aluminium Oxide Nanopowder (Al2O3, 99.99%, <100nm)

NS6130-03-341 – Silicon Oxide Nanopowder (SiO2, S-type, Purity: 99.9%, APS: 15-20nm)

NS6130-03-350 – Titanium Oxide Nanopowder (TiO2, Anatase, 99.9%, 10-25nm)

NS6130-10-1002 – P Type Silicon Wafer (4″ Boron Doping)

NS6130-03-341 – SiO2 Nanoparticles (Silicon Dioxide, 15-20nm, 99.9%, S-type)

NS6130-10-1007 – Metallic Copper Foamposite (Cu, PPI-50PPI, Thickness; 2mm)

NS6130-10-1052 – Titanium Sputtering Target (Ti, Purity: 99.99%)

NS6130-10-1214 – Aluminium Metal Foam (Al, Closed Cell, 2-11mm)

NS6130-10-1233 – Screen Printed Electrodes (3-electrodes)

NS6130-06-640 – Pristine MWCNT (99%, OD:10-20nm, Length:3-8μm)

NS6130-06-601 – Single Walled Carbon Nanotubes (>98wt% OD:1-2nm, Length:3-8µm, High Purity)

NS6130-06-680 – Industrial Grade Carbon Nanotubes in bulk quantities

NS6130-06-659 – COOH Functionalized CNT (Carbon Nanotubes, OD: 10-20nm, Length: 3-8µm)

NS6130-03-364 – Single Layer Graphene (C, >50%, Thickness 0.5-6nm, Lateral Size 1-10µm)

NS6130-03-365 – Multilayer Graphene (C, 4-6 Layer Flakes, >80%, 1-10µm)

NS6130-06-659 – COOH Functionalized CNT (Carbon Nanotubes, OD: 10-20nm, Length: 3-8µm)

NS6130-09-907 – Montmorillonite (Natural montmorillonite Modified, >99%, <80nm)