Home » Microcrystalline cellulose (Thickness: 500µm, Diameter: 125mm)


Stock No. CAS MSDS Specification COA
NS6130-10-1231 N/A MSDS pdf Specification pdf

Microcrystalline cellulose (Thickness: 500µm, Diameter: 125mm)

Microcrystalline cellulose

Microcrystalline cellulose (Thickness: 500µm, Diameter: 125mm)

Quality Control: Each lot of Microcrystalline cellulose was tested successfully.

Microcrystalline cellulose

Microcrystalline cellulose

Product Microcrystalline cellulose
Stock No NS6130-10-1231
Purity 97.0 - 102% Confirm
Diameter 150 mm ± 1mm Confirm
Thickness 500µm Confirm
Sulphated Ash 0.2% Confirm
Heavy Metals 10ppm Confirm
Arsenic 2ppm Confirm
Water Solubility 0.2% (max) Confirm
Organic Impurities Absent Confirm
Starch & Dextrines Absent Confirm
pH 5.0-7.5 Confirm
Shape Round Confirm
Loss in Drying 6% Confirm
Main Inspect Verifier Manager QC

Expert Reviews

Dr. Henrik Jensen,Ph.D , (Middle East Technical University Ankara, Turkey)

Silicon wafers are key component in integrated circuits. Integrated circuits are, simply put a composite of various electronic components that are arranged to perform a specific function. Silicon is the principle platform for semiconductor devices. A wafer is a thin slice of the semiconductor material, which serves as the substrate for microelectronic devices built in and over the wafer.

Dr. Chiyoko Hayashi , (Osaka University Suita, Japan)

As silicon wafer’s primary use is in integrated circuits. Integrated circuits power many of devices that can be used by society everyday. Computers and smartphones are just two of the devices that are dependent on this technology. Silicon is the stable among all the semiconductors. Other uses include sensors, such as the tire pressure sensor system and solar cells. Silicon wafers absorbs the photons in sunlight and this in turn create electricity.

Dr. Joris Smits, Ph.D , (Wrocław University of Technology, Poland)

The wafers serves as the substrates for microelectronic devices built in and over the wafer and undergoes many microfabrication process steps such as doping or ion implantation, etching, deposition of various materials and photolithographic pattering.

Dr. Ms. Sally Adams , (National Technical University of Athens)

Silicon wafers are available in a variety of diameters from 25.4mm (1 inch) to 300mm. The diameter has gradually increased to improve throughput and reduce cost with the current state –of-the-art of fab considered to be 300mm with the next standard projected to be 450mm.

Dr. Peter Bruggmann , (Technical University of Madrid, Spain)

Wafer thickness is determined by the mechanical strength of the material used the wafer must be thick enough to support its own weight without cracking during handling. Wafers are grown from crystals having a regular crystal structure, with silicon having a diamond cubic structure. Orientation is defined by the Miller index with (100) or (111) faces being the most common for silicon. Ion implantation depths depend on the wafer’s crystal orientation, since each direction offers distinct paths for transport.

Microcrystalline cellulose

Microcrystalline cellulose

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