Product | Copper Foam | |
Stock No | NS6130-10-1006 | |
CAS | 7440-50-8 | Confirm |
Thickness | 1mm | Confirm |
PPI | 50 | |
Size | 500×500mm | |
Pore Size | 1mm (50ppi) | |
Porosity | 50%-98% | |
Molecular Formula | Cu | |
Molecular Weight | 63.55g/mol | |
Density | 8.96g/cm3 | |
Melting Point | 1085°C | |
Boiling Point | 2562°C | |
Thermal Expansion | 16.5µm.m-1.k-1 | |
Thermal Conductivity | 401W.m-1.k-1 | |
Tensile Strength | 1.25N/mm | |
Young’s modulus | 110-128GPa | |
Shear strength | 190Psi | |
Vickers hardness | 369MPa | |
Poisson’s ratio | 0.34 | |
Electrical resistivity | 1.673µΩ-cm | |
Specific heat | 0.39kj/kgK | |
Electronegativity | 1.90paulings | |
Heat of fusion | 13.26kJ.mol-1 | |
Heat of vaporization | 300.4kJ.mol-1 | |
Quality Control | Each Lot of was tested successfully | |
Main Inspect Verifier | Manager QC |
Assay | 99.9% |
Other Metal | 850ppm |