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Conductive Ink / Paste

Stock No.
NS6130-01-157
CAS
7440-57-5/7440-31-5
MSDS
MSDS-PDF
Specifications
SPEC-PDF
COA
COA-PDF
Catalogue

Gold Tin Solder Paste

(AuSn, Purity: 99.9%, APS: 80-100nm)
Gold Tin Solder Paste
Available Pack Size: 10Gms, 25Gms, 50Gms, 100Gms, 250Gms, 500Gms, 1Kg & Bulk orders
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Particles Size Analysis - Gold Tin Solder Paste
Product Indication.
IndicationNS6130-01-157
AlloySn20/Au80 (Standard), Sn25/Au75 (upon request), Other alloys are available on request
Physical Properties.
Particle Size80-100nm
ShapeSpherical
Melting PointSn20/Au80 = 280°C, Sn25/Au75 = 280°C
CompositionSn20/Au80
DensitySn20/Au80 = 7.4 g/cc, Sn25/Au75 = 7.4 g/cc
Solder Paste.
Metal ContentStandard 89% ± 1%
Viscosity Range130 ± 40 Pas, Physica CSS 10 s-1
Density3.99 ± 0.2 g/ml
Performance Properties.
Typical Print Thickness0.4 – 0.65 mm pitch: 150 microns, <0.4 mm pitch: 120 microns
Minimum Pitch16 mil (400 microns)
Minimum Pad Width8 mil (200µm, Stencil Thickness -150 µm
Quality ControlEach Lot of Gold Tin Solder Paste was tested successfully
Main Inspect VerifierManager QC

Typical Chemical Analysis

Assay 99.9%
Other Metal< 750 ppm

Expert Reviews

product-expert-image
Dr. Ms. Kamiko Chang, Ph.D (University of Science and Technology Beijing, China)

Gold Tin Solder Paste is used in a variety of high-reliability applications, where its high melting point, non-creep, high-tensile stress, thermal and electrical conductivity, as well as proven usage life makes it a standard “known-good” material. Gold tin solder paste properties Ultra-high reliability for joining and sealing, Fluxless soldering processes, Hermetic sealing, Joining gold-plated surfaces etc.

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Dr. Nicholaos G. Demas (Newcastle University School Of Machanical &amp; Systems Engg. UK)

Gold Tin Solder Paste can be applied by various method such as printing, disperse, pin transfer etc. Gold tin solder has higher performance of fluidity and wet ability in melting also has excellent electrical and thermal conductivity and high strength.

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Dr. Myron Rubenstein, Ph.D (Polytechnic University of Turin, Italy)

Gold Tin Solder Paste is hard and brittle it is difficult to make them smaller. It is also unable to low cost trend of the assembly process when these providing method low cost assembly for fine paste and devices we have developing gold tin solder paste. The soldering can ensure high speed and efficient processing.

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Dr. Ms. Guixin (Susan), Ph.D (Switzerland-Institute for Inorganic Chemistry, Zurich, Switzerland)

Gold Tin Solder Paste offers particular advantages when used when soldering rope chain, hollow shells, findings, earring posts, and jump rings. The “Gold Tin Solder Paste” contains a highly active combination of chemical fluxes added to the paste to clean and protect the base metal and solder during the heating cycle.

nanoshel-experts

Gold Tin Solder Paste

Contact Us:
From us, you can easily purchase Gold Tin Solder Paste (AuSn, Purity: 99.9%, APS: 80-100nm) at great prices. Place online order and we will dispatch your order through DHL, FedEx, UPS. You can also request for a quote by mailing us at sales@nanoshel.com. We invite you to contact us for further information about our company and our capabilities. At Nanoshel, we could be glad to be of service to you. We look forward to your suggestions and feedback.
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+1 646 470 4911
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+44 1782 454 144
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+91-9779550077
+91-9779238252
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Gold Tin Solder Paste (AuSn, Purity: 99.9%, APS: 80-100nm)

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