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Conductive Ink / Paste
Gold Tin Solder Paste
(AuSn, Purity: 99.9%, APS: 80-100nm)
Gold Tin Solder Paste
Available Pack Size: 10Gms, 25Gms, 50Gms, 100Gms, 250Gms, 500Gms, 1Kg & Bulk orders
Lead Free Reflow profile
Particles Size Analysis - Gold Tin Solder Paste
| Product Indication | . | |
| Indication | NS6130-01-157 | |
| Alloy | Sn20/Au80 (Standard), Sn25/Au75 (upon request), Other alloys are available on request | |
| Physical Properties | . | |
| Particle Size | 80-100nm | |
| Shape | Spherical | |
| Melting Point | Sn20/Au80 = 280°C, Sn25/Au75 = 280°C | |
| Composition | Sn20/Au80 | |
| Density | Sn20/Au80 = 7.4 g/cc, Sn25/Au75 = 7.4 g/cc | |
| Solder Paste | . | |
| Metal Content | Standard 89% ± 1% | |
| Viscosity Range | 130 ± 40 Pas, Physica CSS 10 s-1 | |
| Density | 3.99 ± 0.2 g/ml | |
| Performance Properties | . | |
| Typical Print Thickness | 0.4 – 0.65 mm pitch: 150 microns, <0.4 mm pitch: 120 microns | |
| Minimum Pitch | 16 mil (400 microns) | |
| Minimum Pad Width | 8 mil (200µm, Stencil Thickness -150 µm | |
| Quality Control | Each Lot of was tested successfully | |
| Main Inspect Verifier | Manager QC | |
Typical Chemical Analysis
| Assay | 99.9% |
| Other Metal | < 750 ppm |
Expert Reviews
Gold Tin Solder Paste is used in a variety of high-reliability applications, where its high melting point, non-creep, high-tensile stress, thermal and electrical conductivity, as well as proven usage life makes it a standard “known-good” material. Gold tin solder paste properties Ultra-high reliability for joining and sealing, Fluxless soldering processes, Hermetic sealing, Joining gold-plated surfaces etc.
Gold Tin Solder Paste can be applied by various method such as printing, disperse, pin transfer etc. Gold tin solder has higher performance of fluidity and wet ability in melting also has excellent electrical and thermal conductivity and high strength.
Gold Tin Solder Paste is hard and brittle it is difficult to make them smaller. It is also unable to low cost trend of the assembly process when these providing method low cost assembly for fine paste and devices we have developing gold tin solder paste. The soldering can ensure high speed and efficient processing.
Gold Tin Solder Paste offers particular advantages when used when soldering rope chain, hollow shells, findings, earring posts, and jump rings. The “Gold Tin Solder Paste” contains a highly active combination of chemical fluxes added to the paste to clean and protect the base metal and solder during the heating cycle.
