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Product | Platinum Coated Silicon Wafer | |
Stock No | NS6130-10-1179 | |
CAS | 7440-21-3 | Confirm |
Diameter | 4” (101.6mm) | Confirm |
Crystal Orientation | <100> | Confirm |
Deposit Layers: | . | |
Titanium Dioxide (TiO2) | 400Å ± 50Å (Polished side) | Confirm |
Silicon Dioxide (SiO2) | 1micron (0.50 micron on both sides of wafer) | Confirm |
Platinum (Pt) | 1500Å ± 100Å (Polished side) | Confirm |
Typical Pt Resistivity | 1-20 Ohm-cm | Confirm |
Growth Method | CZ | Confirm |
Resistivity | 15 Ω-cm (1-20) | Confirm |
Surface | Single Side Polished | Confirm |
Coating | Platinum | Confirm |
Water Configuration | p-type Si + SiO2 + TiO2 + Pt | Confirm |
Surface roughness | ≤ 5 Å | Confirm |
Thickness of Platinum Layer | 150-200nm | Confirm |
Grade | Prime | Confirm |
Thickness of Si wafer | <500 μm | Confirm |
RRG | ≤12 % | Confirm |
Oxygen Contents | 12.5-16.5 ppma | Confirm |
Carbon Contents | ≤1 ppma | Confirm |
Shape | Cicular | Confirm |
Quality Control | Each Lot of was tested successfully | |
Main Inspect Verifier | Manager QC |